Capability

Topsearch Printed Circuits Capabilities (Q2 2006)


Item
Production
Prototype
Max Layer Count 18 26
Max Board Thickness 0.175Ħħ 0.200Ħħ
Min Board Thickness 0.014Ħħ 0.012Ħħ
Drill to Metal 0.008Ħħ 0.007Ħħ
Innerlayer Registration +/- 0.003Ħħ +/- 0.003Ħħ
Line Width/Spacing, Outer/Inner (17 micron) 0.003Ħħ / 0.003Ħħ
 0.003Ħħ / 0.003Ħħ
Aspect Ratio </= 8:1 </= 12:1
Min QFP Pitch (not HASL) 0.016Ħħ 0.010Ħħ
Controlled Impedance(Single ended)
        (Differential)		 50 - 90 ohms +/- 8%*
100 - 155 ohms +/- 10%*		 50 - 90 ohms +/- 7%*
100 - 155 ohms +/- 8%*
Max Internal Copper Wt. 6 oz 6 oz
HDI(1+N+1 Max Layer Count) -Min Via Size
                               - Min Capture Pad Size		 0.004Ħħ
0.012Ħħ		 0.004Ħħ
0.012Ħħ

* Less than 10% impedance tolerance capability is design dependent.


High Performance materials
Production
Prototype
Bismalemide Triazine
(BT) or equivalent
Yes
Yes
Nelco N - 4000 - 13 (SI)
Yes
Yes
Nelco N - 4000 - 13
Yes
Yes
Getek / Megtron
Yes
Yes
Rogers 4350
Yes
Yes
Rogers 3003/3006
Yes
Yes
Taconic RF35
Yes
Yes
Hitachi MCL-BE-67G
Yes
Yes
Polyclad PCL-FR370HR
Yes
Yes
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